NXP Semiconductors
BGX7100
Transmitter IQ modulator
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 54. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
18. Abbreviations
Table 17. Abbreviations
Acronym
Description
DAC
Digital-to-Analog Converter
DC
Direct Current
ESD
ElectroStatic Discharge
FCDM
Field-induced Charged-Device Model
HBM
Human Body Model
IF
Intermediate Frequency
LO
Local Oscillator
PCB
Printed-Circuit Board
RF
Radio Frequency
TDD
Time Division Duplex
BGX7100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 3 September 2012
© NXP B.V. 2012. All rights reserved.
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