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BGX7220 データシートの表示(PDF) - NXP Semiconductors.

部品番号
コンポーネント説明
メーカー
BGX7220
NXP
NXP Semiconductors. NXP
BGX7220 Datasheet PDF : 26 Pages
First Prev 21 22 23 24 25 26
NXP Semiconductors
14. Package outline
HVQFN36: plastic thermal enhanced very thin quad flat package; no leads;
36 terminals; body 6 x 6 x 0.85 mm
D
terminal 1
index area
BA
BGX7220
Dual receiver down mixer
SOT1092-2
E
A A1
c
detail X
e1
e
10
L
9
Eh
b
18
v CAB
wC
19
e
e2
y1 C
C
y
1
27
terminal 1
36
28
X
index area
Dh
Dimensions
0
2.5
5 mm
scale
Unit
A(1) A1 b
c D(1) Dh E(1) Eh e e1 e2 L
v
w
y y1
max 1.00 0.05 0.30
6.1 4.05 6.1 4.05
mm nom 0.85 0.02 0.21 0.2 6.0 3.90 6.0 3.90 0.5 4 4
min 0.80 0.00 0.18
5.9 3.75 5.9 3.75
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
0.65
0.55 0.1 0.05 0.05 0.1
0.45
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT1092-2
---
---
sot1092-2_po
Issue date
09-02-23
09-02-24
Fig 40. Package outline SOT1092-2 (HVQFN36)
BGX7220
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 8 August 2012
© NXP B.V. 2012. All rights reserved.
21 of 26

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