NXP Semiconductors
14. Package outline
HVQFN36: plastic thermal enhanced very thin quad flat package; no leads;
36 terminals; body 6 x 6 x 0.85 mm
D
terminal 1
index area
BA
BGX7221
Dual receiver down mixer
SOT1092-2
E
A A1
c
detail X
e1
e
10
L
9
Eh
b
18
v CAB
wC
19
e
e2
y1 C
C
y
1
27
terminal 1
36
28
X
index area
Dh
Dimensions
0
2.5
5 mm
scale
Unit
A(1) A1 b
c D(1) Dh E(1) Eh e e1 e2 L
v
w
y y1
max 1.00 0.05 0.30
6.1 4.05 6.1 4.05
mm nom 0.85 0.02 0.21 0.2 6.0 3.90 6.0 3.90 0.5 4 4
min 0.80 0.00 0.18
5.9 3.75 5.9 3.75
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
0.65
0.55 0.1 0.05 0.05 0.1
0.45
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT1092-2
---
---
sot1092-2_po
Issue date
09-02-23
09-02-24
Fig 22. Package outline SOT1092-2 (HVQFN36)
BGX7221
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 8 August 2012
© NXP B.V. 2012. All rights reserved.
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