RTPA5250-130 データシートの表示（PDF） - Raytheon Company
部品番号
コンポーネント説明
メーカー
RTPA5250-130 Datasheet PDF : 13 Pages
| |||
Application
Information
RTPA5250-130
3.3V UNII Band Power Amplifier
MMIC/Switch Module for WLAN
PRODUCT INFORMATION
Precautions to Avoid Permanent Device Damage:
– Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. Devices should
remain in their original packaging until component placement to ensure no contamination or damage to RF,
DC & ground contact areas.
– Device Cleaning: Standard board cleaning techniques should not present device problems provided that
the boards are properly dried to remove solvents or water residues.
– Static Sensitivity: Follow ESD precautions to protect against ESD damage:
• A properly grounded static-dissipative surface on which to place devices.
• Static-dissipative floor or mat.
• A properly grounded conductive wrist strap for each person to wear while handling devices.
– General Handling: Handle the package on the top with a vacuum collet or along the edges with a sharp
pair of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not
apply excessive pressure to the top of the lid.
– Device Storage: Devices are supplied in heat-sealed, moisture-barrier bags. In this condition, devices are
protected and require no special storage conditions. Once the sealed bag has been opened, devices should
be stored in a dry nitrogen environment.
Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand
soldering is not recommended.
– Reflow Profile
• Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to
prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing. A
typical heating rate is 1- 2°C/sec.
• Pre-heat/soak: The soak temperature stage serves two purposes; the flux is activated and the board
and devices achieve a uniform temperature. The recommended soak condition is: 120-150 seconds at
150°C.
• Reflow Zone: If the temperature is too high, then devices may be damaged by mechanical stress due to
thermal mismatch or there may be problems due to excessive solder oxidation. Excessive time at
temperature can enhance the formation of inter-metallic compounds at the lead/board interface and
may lead to early mechanical failure of the joint. Reflow must occur prior to the flux being completely
driven off. The duration of peak reflow temperature should not exceed 10 seconds. Maximum soldering
temperatures should be in the range 215-220°C, with a maximum limit of 225°C.
• Cooling Zone: Steep thermal gradients may give rise to excessive thermal shock. However, rapid
cooling promotes a finer grain structure and a more crack-resistant solder joint. Figure 1 indicates the
recommended soldering profile.
Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free attachment of the
heatsink to the PWB. The solder joint should be 95% void-free and be a consistent thickness.
Rework Considerations: Rework of a device attached to a board is limited to reflow of the solder with a heat
gun. The device should not be subjected to more than 225°C and reflow solder in the molten state for more than
5 seconds. No more than 2 rework operations should be performed.
www.raytheonrf.com
Characteristic performance data and specifications are subject to change without notice.
Revised January 25, 2002
Page 4
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
Share Link: 