DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

FDS6679Z データシートの表示(PDF) - Fairchild Semiconductor

部品番号
コンポーネント説明
メーカー
FDS6679Z
Fairchild
Fairchild Semiconductor Fairchild
FDS6679Z Datasheet PDF : 5 Pages
1 2 3 4 5
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BV DSS
Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA
–30
V
BV DSS
TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
ID = –250 µA, Referenced to 25°C
VDS = –24 V, VGS = 0 V
–23
mV/°C
–1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = –25 V, VDS = 0 V
100 nA
IGSSR
Gate–Body Leakage, Reverse
VGS = –25 V, VDS = 0 V
–100 nA
On Characteristics (Note 2)
V GS(th)
Gate Threshold Voltage
V GS(th)
TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = –250 µA
–1 –1.6 –3
V
ID = –250 µA, Referenced to 25°C
5
mV/°C
VGS = –10 V, ID = –13 A
VGS = –4.5 V, ID = –11 A
VGS=–10 V, ID =–13 A, TJ=125°C
7.3
9
m
10 13
9.5 13
VGS = –10 V, VDS = –5 V
–50
A
VDS = –5 V,
ID = –13 A
44
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = –15 V, V GS = 0 V,
f = 1.0 MHz
3939
pF
972
pF
498
pF
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = –15 V,
VGS = –10 V,
ID = –1 A,
RGEN = 6
VDS = –15 V, ID = –13 A,
VGS = –10 V
19 34
ns
10 20
ns
110 176 ns
65 104 ns
71 100 nC
12
nC
15
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = –2.1 A (Note 2)
–2.1 A
–0.7 –1.2 V
Notes:
1. RθJAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCAis determined by the user's board design.
a) 50°C/W (10 sec)
62.5°C/W steady state
when mounted on a
1in2 pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
b) 105°C/W when
mounted on a .04 in2
pad of 2 oz copper
c) 125°C/W when mounted on a
minimum pad.
FDS6679 Rev C(W)

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]