CXA3067AM データシートの表示（PDF） - Sony Semiconductor

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CXA3067AM

Wide Band FSK Receiver

Sony Semiconductor 

Package Outline Unit : mm

30

30PIN SOP(PLASTIC)

+ 0.4

18.8 – 0.1

16

+ 0.4

2.3 – 0.15

0.1

+ 0.2

0.1 – 0.05

A

1

0.45 ± 0.1

0.2 M

15

1.27

+ 0.1

0.2 – 0.05

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

30

SOP-30P-L03

SOP030-P-0375

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.7g

30PIN SOP (PLASTIC)

+ 0.4

18.8 – 0.1

16

+ 0.4

2.3 – 0.15

0.1

+ 0.2

0.1 – 0.05

A

1

0.45 ± 0.1

0.2 M

15

1.27

+ 0.1

0.2 – 0.05

0˚ to 10˚

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-30P-L03

SOP030-P-0375

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

0.7g

LEAD PLATING SPECIFICATIONS

ITEM

LEAD MATERIAL

SOLDER COMPOSITION

PLATING THICKNESS

SPEC.

COPPER ALLOY

Sn-Bi Bi:1-4wt%

5-18µm

—24—

CXA3067AM

Sony Corporation

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