CXK58512M データシートの表示（PDF） - Sony Semiconductor
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CXK58512M Datasheet PDF : 12 Pages
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Package Outline
Unit: mm
CXK58512TM
32PIN TSOP (I) (PLASTIC)
8.0 ± 0.2
32
17
+ 0.2
1.07 – 0.1
0.1
0.1 ± 0.1
+ 0.08 1
0.2 – 0.03
0.08 M
16
0.5
A
0.127
+
–
0.05
0.02
0° to 10°
DETAIL A
CXK58512M
NOTE: Dimension “∗” does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP (I) -32P-L01
TSOP (I) 032-P-0820-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
42 ALLOY
32PIN SOP (PLASTIC) 525mil
+ 0.4
20.5 – 0.1
32
17
+ 0.15
2.9 – 0.25
0.1
A
1
0.4 ± 0.1
16
1.27
+ 0.1
0.15 – 0.05
0.2 ± 0.1
0.12 M
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-32P-L02
∗SOP032-P-0525-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY / PHENOL RESIN
SOLDER PLATING
42 ALLOY
PACKAGE WEIGHT
– 12 –
CXK58512TM/M
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