CY62136V データシートの表示（PDF） - Cypress Semiconductor
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CY62136V Datasheet PDF : 13 Pages
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CY62136V MoBL®
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage to Ground Potential ............... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State[5] ....................................–0.5V to VCC + 0.5V
DC Input Voltage[5].................................–0.5V to VCC + 0.5V
Output Current into Outputs (LOW)............................ 20 mA
Static Discharge Voltage........................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current..................................................... > 200 mA
Operating Range
Range
Industrial
Ambient Temperature [TA][7]
VCC
−40°C to +85°C
2.7V to 3.6V
Automotive
−40°C to +125°C
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
CY62136V-55
CY62136V-70
Min. Typ.[2] Max. Min. Typ.[2] Max. Unit
VOH
Output HIGH Voltage IOH = −1.0 mA VCC = 2.7V
VOL
Output LOW Voltage IOL = 2.1 mA
VCC = 2.7V
VIH
Input HIGH Voltage
VCC = 3.6V
2.4
2.4
V
0.4
0.4 V
2.2
VCC + 2.2
VCC+ V
0.5V
0.5V
VIL
Input LOW Voltage
VCC = 2.7V
–0.5
IIX
Input Leakage Current GND < VI < VCC
Industrial –1
Automotive
0.8 –0.5
+1 –1
–10
0.8 V
+1 µA
+10 µA
IOZ
Output Leakage
GND < VO < VCC,
Current
Output Disabled
Industrial –1
Automotive
+1 –1
–10
+1 µA
+10 µA
ICC
VCC Operating Supply f = fMax = 1/tRC, VCC = 3.6V, Industrial
Current
IOUT = 0 mA,
CMOS
Automotive
f = 1 MHz,
Levels
7 20
1
2
7 15 mA
7 20 mA
1 2 mA
ISB1
Automatic CE
CE > VCC−0.3V,
Power-down Current— VIN > VCC−0.3V or VIN < 0.3V,
CMOS Inputs
f = fMax
ISB2
Automatic CE
CE > VCC−0.3V VCC = 3.6V Industrial
Power-down Current— VIN > VCC−0.3V or
CMOS Inputs
VIN < 0.3V, f = 0
Automotive
100
1 15
100 µA
1 15 µA
1 20
Capacitance[6]
Parameter
Description
CIN
COUT
Input Capacitance
Output Capacitance
Thermal Resistance[6]
Parameter
Description
ΘJA
Thermal Resistance
(Junction to Ambient)
ΘJC
Thermal Resistance
(Junction to Case)
Test Conditions
TA = 25°C, f = 1 MHz, VCC = VCC(typ)
Max.
6
8
Unit
pF
pF
Test Conditions
Still Air, soldered on a 4.25 x 1.125 inch,
2-layer printed circuit board
FBGA
41.17
11.74
TSOPII
60
22
Unit
°C/W
°C/W
Notes:
5. VIL(min) = –2.0V for pulse durations less than 20 ns.
6. Tested initially and after any design or process changes that may affect these parameters.
7. TA is the “Instant-On” case temperature.
Document #: 38-05087 Rev. *D
Page 4 of 13
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