M59MR032C, M59MR032D
Table 36. Ordering Information Scheme
Example:
M59MR032C
Device Type
M59
Architecture
M = Multiplexed Address/Data, Dual Bank, Burst Mode
Operating Voltage
R = 1.8V
Device Function
032C = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Top Boot
032D = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Bottom Boot
Speed
100 = 100 ns
120 = 120 ns
Package
ZC = LFBGA54: 0.5 mm pitch
GC = µBGA46: 0.5 mm pitch
Temperature Range
6 = –40 to 85°C
Option
T = Tape & Reel packing
100 GC 6 T
Devices are shipped from the factory with the memory content bits erased to ’1’.
Table 37. Daisy Chain Ordering Scheme
Example:
Device Type
M59MR032
Daisy Chain
-GC = µBGA46: 0.5 mm pitch
Option
T = Tape & Reel Packing
M59MR032
-GC T
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the STMicroelectronics Sales Office nearest to you.
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