M29DW323DB70N6T データシートの表示（PDF） - STMicroelectronics
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コンポーネント説明
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M29DW323DB70N6T
STMicroelectronics
M29DW323DB70N6T Datasheet PDF : 51 Pages
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M29DW323DT, M29DW323DB
DUAL OPERATIONS AND MULTIPLE BANK ARCHITECTURE
The Multiple Bank Architecture of the
M29DW323DT and M29DW323DB gives greater
flexibility for software developers to split the code
and data spaces within the memory array. The
Dual Operations feature simplifies the software
management of the device by allowing code to be
executed from one bank while the other bank is
being programmed or erased.
The Dual Operations feature means that while pro-
gramming or erasing in one bank, read operations
are possible in the other bank with zero latency.
Only one bank at a time is allowed to be in pro-
gram or erase mode.
If a read operation is required in a bank, which is
programming or erasing, the program or erase op-
eration can be suspended.
Also if the suspended operation was erase then a
program command can be issued to another
block, so the device can have one block in Erase
Suspend mode, one programming and other
banks in read mode.
By using a combination of these features, read op-
erations are possible at any moment.
Table 9. and Table 10. show the dual operations
possible in other banks and in the same bank.
Note that only the commonly used commands are
represented in these tables.
Table 9. Dual Operations Allowed In the Other Bank
Status of First
Bank(1)
Read
Array
Commands allowed in the Other Bank(1)
Read Status
Register(6)
Read
CFI
Query
Auto
Select
Program Erase
Erase
Suspend
Erase
Resume
Idle
Yes
Yes(2)
Yes
Yes
Yes
Yes
Yes(2)
Yes(3)
Programming
Yes
No
No
No
–
–
No
No
Erasing
Yes
No
No
No
–
–
No
No
Erase Suspended
Yes
Yes
Yes
Yes
Yes
No
-
Yes
Note: 1. If one bank is involved in a program or erase operation, then the other bank is available for dual operations.
2. Only after an Erase operation in that bank.
3. Only after an Erase Suspend command in that bank.
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