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NX29F010-45PL データシートの表示(PDF) - NexFlash -> Winbond Electronics

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NX29F010-45PL Datasheet PDF : 25 Pages
First Prev 21 22 23 24 25
NX29F010
PACKAGING INFORMATION
Plastic TSOP - 32-pins
Package Code: T (Type I)
1
EH
N
D
SEATING PLANE
S
A
e
B
A1
L
α
C
Plastic TSOP (T—Type I)
Millimeters
Inches
Symbol Min Max
Min Max
Ref. Std.
No. Leads
32
A
1.20
A1
0.05 0.15
B
0.17 0.27
C
0.10 0.21
D
7.90 8.10
E
18.30 18.50
H
19.80 20.20
e
0.50 BSC
L
0.50 0.70
a
0° 5°
0.047
0.002 0.005
0.007 0.009
0.004 0.008
0.308 0.316
0.714 0.722
0.772 0.788
0.020 BSC
0.016 0.024
0°
5°
22
Notes:
1. Controlling dimension: millimeters, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect to
one another within 0.004 inches at the
seating plane.
NexFlash Technologies, Inc.
NXPF001F-0600
06/22/00 ©

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