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DS2432 データシートの表示(PDF) - Maxim Integrated

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DS2432 Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
ABRIDGED DATA SHEET
DS2432
REVISION HISTORY
REVISION
DATE
DESCRIPTION
040907 Initial release.
Removed the leaded parts from the Ordering Information table and
corrected package name from µCSP to UCSPR.
Removed 64-Bit Registration Number from Overdrive Skip ROM in
Figure 2.
Removed reference to tamper detect register (does not exist).
060608
In Figure 8, changed “5µA typ” to “IL”.
In the DC Electrical Characteristics table, added the 1-Wire Pullup
Voltage parameter (VPUP) (moved from the headline into the table) and
removed the 1-Wire Output High parameter (VOH). In the EEPROM table,
added (at +85°C) to the Data Retention parameter.
Added Package Information section.
Minor nontechnical corrections to the text (various pages).
Electrical characteristics table: tRECMIN changed from 1µs to 5µs (regular
speed) and 2µs (overdrive speed); VILMAX changed from “TBD” to 0.3V;
SHA-1 computation current added.
UCSP package outline deleted; see section Package Information to access
2/10
the latest drawing.
Typo- and style corrections
Original Note 8 deleted from EC table notes and remaining notes
renumbered to conform to Style Guide.
Deleted DS2432X+ from the Ordering Information table.
Updated the soldering information and added the lead temperature to the Absolute
Maximum Ratings.
3/12
Added Note 12 to AC Electrical Characteristics: Regular Speed table parameters
tPDHIGH and tPDLOW.
Revised the electrical characteristics tables Note 7.
Added the land pattern column to the Package Information table.
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Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses
are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
2012 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products.

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