Typical Performance Curves (Continued)
Slew Rate vs Temperature
155
EL2126
Positive Loaded Output Swing vs Temperature
3.52
150
VS=±15V
145
3.5
3.48
VS=±5V
140
VO=2VPP
135
-50
0
50
100
150
Die Temperature (°C)
Positive Loaded Output Swing vs Temperature
11.8
11.6
VS=±15V
11.4
11.2
11
10.8
10.6
-50
0
50
100
150
Die Temperature (°C)
Negative Loaded Output Swing vs Temperature
-9.4
-9.6
-9.8
VS=±15V
-10
-10.2
-10.4
-10.6
-50
0
50
100
150
Die Temperature (°C)
3.46
3.44
-50
0
50
100
150
Die Temperature (°C)
Negative Loaded Output Swing vs Temperature
-3.35
-3.4
-3.45
-3.5
VS=±5V
3.55
-3.6
-50
0
50
100
150
Die Temperature (°C)
Package Power Dissipation vs Ambient Temperature
JEDEC JESD51-3 Low Effective Thermal Conductivity
Test Board
1.2
1
781mW
0.8
0.6
θJA
488mW
=+160S°CO/8W
0.4
0.2
θJA =+S25O6T°2C3/W-5
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
Package Power Dissipation vs Ambient Temperature
JEDEC JESD51-7 High Effective Thermal Conductivity
Test Board
1.8
1.6
1.4
1.2 1.136W
1
0.8
0.6
0.4
543mW θJA =+110S°OC8/W
θJA
SOT23-5
=+230°C/W
0.2
0
0
25
50
75 85 100 125 150
Ambient Temperature (°C)
13
FN7046.3
April 16, 2007