FA7764P データシートの表示（PDF） - Fuji Electric

部品番号

コンポーネント説明

メーカー

FA7764P

DC/DC Power Supply control IC

Fuji Electric 

FA7764

(6) Mounting SOP-8 (E-Pad)

Mounting the SOP-8 (E-Pad) package of this IC is

by providing a 4-layer board on which to mount

components for reducing the thermal resistance of

the package, along with a GND pattern in the

intermediate layer of the board, and connect the

package E-Pad by using several thermal via.

Fig. 8 shows a recommended foot pattern.

3×1.27=3.81

0.76

(1.2)

(φ0.3)

Thermal via

1.27

3.10

Note 2.

Notes:

1. The exposed pad pattern conforms to JEDEC

JESD51-5.

2. The resist is the same as that of the exposed

pad. Thermal via should also be placed in

positions outside of the resist opening area.

(7) Recommendation of continuous mode

operation

There is a possibility of jumping up the output voltage

in a discontinuous mode.

In order to prevent from this jumping up voltage, the

continuous mode operation is recommended.

Fuji Electric Systems Co., Ltd.

AN-059E Rev.1.0

16

June.2010

http://www.fujielectric.co.jp/fdt/scd/

Share Link: