HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200510
Issued Date : 2005.10.01
Revised Date : 2005.10.06
Page No. : 3/4
SO-8 Dimension
A
G
I
8 76 5
B
CH
Pin1 Index
23 4
D
E
Part A
F
J
K
Part A L
M
N
O
8-Lead SO-8 Plastic
Surface Mounted Package
HSMC Package Code: S
H6968S Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H
6968
Pin 1 Index
Date Code
S
Control Code
Pin Style: 1.S2 2.G2 3.S1 4.G1 5 & 6.D1 7 & 8.D2
H6968CS Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H
6 9 6 8C
Pin 1 Index
Date Code
S
Control Code
Pin Style: 1.S2 2.G2 3.S1 4.G1 5 & 6 & 7 & 8.D
Note: Green label is used for pb-free packing
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
4.85 5.10
B
3.85 3.95
C
5.80 6.20
D
1.22 1.32
E
0.37 0.47
F
3.74 3.88
G
1.45 1.65
H
4.80 5.10
I
0.05 0.20
J
0.30 0.70
K
0.19 0.25
L
0.37 0.52
M
0.23 0.28
N
0.08 0.13
O
0.00 0.15
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H6968S, H6968CS
HSMC Product Specification