HCPL-0708 データシートの表示（PDF） - HP => Agilent Technologies

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HCPL-0708

High Speed CMOS Optocoupler

HP => Agilent Technologies 

Solder Reflow Thermal Profile

300

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK

TEMP.

245°C

200

160°C

150°C

140°C

100

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

PREHEATING TIME

150°C, 90 + 30 SEC.

30

SEC.

30

SEC.

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

50 SEC.

ROOM

TEMPERATURE

0

0

TIGHT

TYPICAL

LOOSE

50

100

150

200

250

TIME (SECONDS)

Regulatory Information

The HCPL-0708 has been

approved by the following

organizations:

UL

Recognized under UL 1577,

component recognition program,

File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File

CA88324.

VDE

Approved according to

VDE 0884/06.92,

File 6591-23-4880-1005.

TUV

Approved according to

VDE 0884/06.92, Certificate

R9650938.

Insulation and Safety Related Specifications

Parameter

Symbol Value

Minimum External Air

Gap (Clearance)

L(I01)

4.9

Minimum External

Tracking (Creepage)

L(I02)

4.8

Minimum Internal Plastic

0.08

Gap (Internal Clearance)

Tracking Resistance

CTI

≥175

(Comparative Tracking Index)

Units

mm

mm

mm

Volts

Conditions

Measured from input terminals to output

terminals, shortest distance through air.

Measured from input terminals to output

terminals, shortest distance path along body.

Insulation thickness between emitter and

detector; also known as distance through

insulation.

DIN IEC 112/VDE 0303 Part 1

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

All Agilent data sheets report the

creepage and clearance inherent

to the optocoupler component

itself. These dimensions are

needed as a starting point for the

equipment designer when

determining the circuit insulation

requirements. However, once

mounted on a printed circuit

board, minimum creepage and

clearance requirements must be

met as specified for individual

equipment standards. For

creepage, the shortest distance

path along the surface of a

printed circuit board between the

solder fillets of the input and

output leads must be considered.

There are recommended

techniques such as grooves and

ribs which may be used on a

printed circuit board to achieve

desired creepage and clearances.

Creepage and clearance distances

will also change depending on

factors such as pollution degree

and insulation level.

3

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