ISL3685 データシートの表示（PDF） - Intersil
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ISL3685 Datasheet PDF : 19 Pages
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ISL3685
Micro Lead Frame Plastic Package (MLFP)
A
6
0.50 DIA.
1
2
3
D
D/2
D1
D1/2
2X
0.25 C A
N
2X
0.25 C B
E1/2 E/2
E1
E
0.20 C B
2X
0.20 C A
2X
TOP VIEW
C
B
A2
A
0.05 C
SEATING
PLANE
4X P
4X P
L
SIDE VIEW
A3 A1
5
b 0.10 M C A B
D2
7
D2/2
N
1
2
3
(Ne-1)Xe
E2
REF.
7
E2/2
e
(Nd-1)Xe
REF.
BOTTOM VIEW
CL
b
5
CC
A1
CL
L44.7x7
44 LEAD MICRO LEAD FRAME PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220-VKKD-1 ISSUE A)
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.039
-
1.00
A1
-
0.002
-
0.05
A2
-
0.031
-
0.80
A3
0.008 REF
0.20 REF
b
0.007 0.012 0.18
0.30
5
D
0.275 BSC
7.00 BSC
D1
0.265 BSC
6.75 BSC
D2
-
0.130
-
3.30
7
E
0.275 BSC
7.00 BSC
E1
0.265 BSC
6.75 BSC
E2
-
0.130
-
3.30
7
e
0.019 BSC
0.50 BSC
L
0.019 0.029 0.50
0.75
N
44
44
2
Nd
11
11
3
Ne
11
11
3
P
0.009 0.024 0.24
0.60
θ
-
12
-
12
NOTES:
Rev. 1 8/00
1. Dimensioning and tolerancing per ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd is the number of terminals in the X direction, and Ne is the
number of terminals in the Y direction.
4. Controlling dimension: Millimeters. Converted dimensions to
inches are not necessarily exact. Angles are in degrees.
5. Dimension b applies to the plated terminal and is measured
between 0.20mm and 0.25mm from the terminal tip.
6. The Pin #1 identifier exists on the top surface as an
indentation mark in the molded body.
7. Dimensions D2 and E2 are the maximum exposed pad
dimensions for improved grounding and thermal
performance.
e
FOR ODD TERMINAL/SIDE
SECTION "C-C"
e
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
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Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/quality/iso.asp.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
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