LH1510AAB データシートの表示（PDF） - Vishay Semiconductors
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LH1510AAB Datasheet PDF : 10 Pages
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www.vishay.com
LH1510AAB, LH1510AABTR, LH1510AT
Vishay Semiconductors
PACKING INFORMATION (in millimeters)
0.35 ± 0.05
Pin 1
2.0 ± 0.1
4.0 ± 0.1
1.5 min.
1.75 ± 0.1
CL
7.77 ± 0.1
7.5 ± 0.1
16.0 ± 0.3
3.9 ± 0.1
4.4 ± 0.1
12.0 ± 0.1
1.5 min.
Fig. 19 - Tape and Reel Packing
10.3 ± 0.1
TAPE AND REEL PACKING
TYPE
SMD-6
UNITS/REEL
1000
TUBE PACKING
TYPE
SMD-6
DIP-6
UNITS/TUBE
50
50
TUBES/BOX
40
40
UNITS/BOX
2000
2000
SOLDER PROFILES
300
5s
250 235 °C to
260 °C
200
First wave
ca. 200 K/s
150
100 °C to
130 °C
100
Axis Title
Lead temperature
Second
wave
ca. 2 K/s
Full line: typical
Dotted lines:
process limits
2 K/s
ca. 5 K/s
50
Forced cooling
10000
1000
100
948626
0
10
0
50
100
150
200
250
Time (s)
Fig. 20 - Wave Soldering Double Wave Profile
According to J-STD-020 for DIP Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 1, according to J-STD-020
Axis Title
300
10000
250 255 °C
240 °C
217 °C
200
150
Max. 120 s
100
Max. 260 °C
245 °C
Max. 30 s
1000
Max. 100 s
100
Max. ramp down 6 °C/s
50 Max. ramp up 3 °C/s
19841
0
10
0
50 100 150 200 250 300
Time (s)
Fig. 21 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020 for SMD Devices
Rev. 1.8, 05-Jul-2018
8
Document Number: 83810
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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