LT1783HS6 データシートの表示（PDF） - Linear Technology

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LT1783HS6

1.25MHz, Over-The-Top Micropower, Rail-to-Rail Input and Output Op Amp in SOT-23

Linear Technology 

PACKAGE DESCRIPTION

S6 Package

6-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1636)

0.62

0.95

MAX

REF

1.22 REF

2.90 BSC

(NOTE 4)

3.85 MAX 2.62 REF

1.4 MIN

2.80 BSC 1.50 – 1.75

(NOTE 4)

PIN ONE ID

LT1783

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

0.20 BSC

DATUM ‘A’

0.95 BSC

0.80 – 0.90

1.00 MAX

0.30 – 0.50 REF

0.09 – 0.20

NOTE:

(NOTE 3)

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

1.90 BSC

0.30 – 0.45

6 PLCS (NOTE 3)

0.01 – 0.10

S6 TSOT-23 0302 REV B

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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