LTC3221 データシートの表示（PDF） - Linear Technology

部品番号

コンポーネント説明

メーカー

LTC3221

Micropower

Linear Technology 

PACKAGE DESCRIPTIO

LTC3221/

LTC3221-3.3/LTC3221-5

DC Package

6-Lead Plastic DFN (2mm × 2mm)

(Reference LTC DWG # 05-08-1703)

2.50 ±0.05

1.15

±0.05

0.61 ±0.05

(2 SIDES)

0.675 ±0.05

PACKAGE PIN 1 BAR

OUTLINE TOP MARK

(SEE NOTE 6)

0.25 ± 0.05

0.50 BSC

1.42 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.200 REF

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

R = 0.115

TYP

0.56 ± 0.05

4

(2 SIDES)

0.38 ± 0.05

6

2.00 ±0.10

(4 SIDES)

0.75 ±0.05

0.00 – 0.05

PIN 1

CHAMFER OF

EXPOSED PAD

3

1

(DC6) DFN 1103

0.25 ± 0.05

0.50 BSC

1.37 ±0.05

(2 SIDES)

BOTTOM VIEW—EXPOSED PAD

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,

no responsibility is assumed for its use. Linear Technology Corporation makes no representation that

the interconnection of its circuits as described herein will not infringe on existing patent rights.

3221f

11

Share Link: