LT5527 データシートの表示（PDF） - Linear Technology

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LT5527

Dual 600MHz to 1.7GHz High Dynamic Range Downconverting Mixer

Linear Technology 

Package Description

UH Package

24-Lead

(R2e4fe-Lreenacde

PLPTllaCasUsDtHtiWiccPGQQaF#FcNkN0a5((g-550emm8-m1m7×4×755RmmemvmA)))

(Reference LTC DWG # 05-08-1747 Rev A)

LTC5590

0.75 ±0.05

5.40 ±0.05

3.90 ±0.05

3.25 REF

3.20 ± 0.05

3.20 ± 0.05

PACKAGE OUTLINE

0.30 ± 0.05

0.65 BSC

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

5.00 ± 0.10

PIN 1

TOP MARK

(NOTE 6)

5.00 ± 0.10

0.75 ± 0.05

R = 0.05

TYP

0.00 – 0.05

3.25 REF

BOTTOM VIEW—EXPOSED PAD

R = 0.150

TYP

23 24

PIN 1 NOTCH

R = 0.30 TYP

OR 0.35 × 45°

CHAMFER

0.55 ± 0.10

1

2

3.20 ± 0.10

3.20 ± 0.10

0.200 REF

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

(UH24) QFN 0708 REV A

0.30 ± 0.05

0.65 BSC

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

5590p

19

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