M36DR432CZA データシートの表示（PDF） - STMicroelectronics

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M36DR432CZA

32 Mbit (2Mb x16, Dual Bank, Page) Flash Memory and 4 Mbit (256K x16) SRAM, Multiple Memory Product

STMicroelectronics 

Table 34. Ordering Information Scheme

Example:

M36DR432C

Device Type

M36 = MMP (Flash + SRAM)

Architecture

D = Dual Bank, Page Mode

Operating Voltage

R = VDDF = VDDS =1.9V to 2.1V

SRAM Chip Size & Organization

4 = 4 Mbit (256K x 16 bit)

Device Function

32C = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Top Boot

32D = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Bottom Boot

Specification Details

A = Flash: 0.25µm; SRAM Cypress 0.25µm, supply 2V, speed 70ns

Speed

85 = 85ns

10 = 100ns

Package

ZA = LFBGA66: 0.8mm pitch

Temperature Range

6 = –40 to 85°C

Option

T = Tape & Reel packing

M36DR432C, M36DR432D

A 85 ZA 6 T

Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available op-

tions (Speed, Package, etc...) or for further information on any aspect of this device, please contact the

STMicroelectronics Sales Office nearest to you.

Table 35. Daisy Chain Ordering Scheme

Example:

M36DR432

-ZA T

Device Type

M36DR432

Daisy Chain

-ZA = LFBGA66: 0.8mm pitch

Option

T = Tape & Reel Packing

41/46

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