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M36P0R8070E0ZACE データシートの表示(PDF) - Numonyx -> Micron

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M36P0R8070E0ZACE Datasheet PDF : 22 Pages
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Package mechanical
6
Package mechanical
M36P0R8070E0
To meet environmental requirements, Numonyx offers these devices in ECOPACK®
packages, which have a lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
Figure 6. TFBGA107 8 x 11 mm 9 x 12 active ball array, 0.8 mm pitch,
package outline
D
D1
FD
E E1
BALL "B1"
Ae
1. Drawing is not to scale.
e
SE
FE
b
A2
A1
ddd
TFBGA-Z2
18/22

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