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M7040N データシートの表示(PDF) - STMicroelectronics

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M7040N Datasheet PDF : 159 Pages
First Prev 151 152 153 154 155 156 157 158 159
M7040N
Table 56. PBGA-ZA – 388-ball Plastic Ball Grid Array Package Mechanical Data
mm
inches
Symb
Typ
Min
Max
Typ
Min
Max
A
2.33
2.20
2.46
0.095
0.090
0.100
A2
0.56
0.022
b(1,2)
0.75
0.60
0.90
0.031
0.024
0.037
D(3,4)
35.00
34.80
35.20
1.429
1.420
1.437
D1
31.75
1.296
D2
30.00
1.224
E(3,4)
35.00
34.80
35.20
1.429
1.420
1.437
e
1.27
0.050
E1
31.75
1.296
E2
30.00
1.224
n
388
388
Tolerance
Tolerance
ddd
0.15
0.006
eee
0.30
0.012
fff
0.15
0.006
Note: 1. The terminal “b” corner must be identified on the top surface by using a corner chamfer, ink, or metallized markings, or other feature
of package body or integral heatslug.
2. A distinguished feature is allowable on the bottom surface of the package to identify the terminal “b” corner.
3. Maximum mounted height is 2.45mm based on a 0.65mm ball pad diameter. Solder paste is 0.15mm thickness and 0.65mm in di-
ameter.
4. Exact shape of each corner is optional.
151/159

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