93C56 データシートの表示（PDF） - STMicroelectronics

部品番号

コンポーネント説明

メーカー

93C56

MICROWIRE serial access EEPROM

STMicroelectronics 

M93C86, M93C76, M93C66, M93C56, M93C46

Package mechanical data

Figure 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, outline

REV MB

REV MC

D

e

b

e

b

L3

L1 L3

L1

Pin 1

E

E2

E2

K

K

L

L

A

D2

ddd

A1

D2

ZW_MEc

1. Drawing is not to scale.

2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be

allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering

process.

3. The circle in the top view of the package indicates the position of pin 1.

Table 26.

Symbol

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

millimeters

inches(1)

Typ

Min

Max

Typ

Min

Max

A

0.55

0.45

0.6

0.0217

0.0177

0.0236

A1

0.02

0

0.05

0.0008

0

0.002

b

0.25

0.2

0.3

0.0098

0.0079

0.0118

D

2

1.9

2.1

0.0787

0.0748

0.0827

D2 (rev MB)

1.6

1.5

1.7

0.063

0.0591

0.0669

D2 (rev MC)

1.45

1.7

0.0571

0.0669

E

3

2.9

3.1

0.1181

0.1142

0.122

E2 (rev MB)

0.2

0.1

0.3

0.0079

0.0039

0.0118

E2 (rev MC)

1.25

1.6

0.0492

0.063

e

0.5

-

-

0.0197

-

-

K

-

0.3

-

-

0.0118

-

L

-

0.3

0.5

-

0.0118

0.0197

L1

-

-

0.15

-

0.0059

L3

0.3

ddd(2)

0.05

-

-

-

0.0118

-

-

0.002

-

-

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

Doc ID 4997 Rev 10

31/37

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