MAS9276A1TG00 データシートの表示（PDF） - Micro Analog systems

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MAS9276A1TG00

IC for 10.00 – 30.00 MHz VCTCXO

Micro Analog systems 

DA9276.003

13 July, 2006

PIN DESCRIPTION

Pin Description

Power Supply Voltage

Programming Input

Serial Bus Clock Input

Serial Bus Data Input

Temperature Output

Test Multiplexer Output

Voltage Control Input

Crystal Oscillator Output

Crystal/Varactor Oscillator Input

Power Supply Ground

Buffer Output

Symbol

VDD

PV

CLK

DA

TE1

TE2

VC

X1

X2

VSS

OUT

x-coordinate

166

420

979

1234

1488

1742

185

439

1357

1790

2046

y-coordinate

1430

1435

1441

1441

1441

1441

153

149

149

166

153

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component

assembly are recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Supply Voltage

Input Voltage

Power Dissipation

Storage Temperature

Note 1: Not valid for programming pin PV

Symbol

VDD - VSS

VIN

PMAX

TST

Min

-0.3

VSS -0.3

-55

Max

6.0

VDD + 0.3

20

150

(test conditions)

Unit

Note

V

V

1)

mW

oC

RECOMMENDED OPERATION CONDITIONS

Parameter

Supply Voltage

Supply Current

Operating Temperature

Storage Temperature

Symbol

VDD

ICC

TC

TS

Crystal Pulling Sensitivity

S

Crystal Load Capacitance

CL

Conditions

Vdd = 2.8 Volt

Relative humidity =

15%…70%

Min

Typ Max

Unit Note

2.7

2.8 5.5

V

1.8

mA

-30

+85

oC

-5

+40

oC

30

ppm/pF

10

pF

2 (8)

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