MAS9278(2003) データシートの表示（PDF） - Micro Analog systems

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MAS9278
(Rev.:2003)

IC for 10.00 – 30.00 MHz VCXO

Micro Analog systems 

DA9278.002

29 January 2003

PIN DESCRIPTION

Pin Description

Symbol

x-coordinate

y-coordinate

Power Supply Voltage

Serial Bus Data Input

Serial Bus Clock Input

VDD

177

DA

435

CLK

201

172

1015

1015

Programming Input

PV

1042

1015

Voltage Control Input

VC

1012

158

Crystal Oscillator Output

X1

374

158

Power Supply Ground

VSS

830

1008

Crystal/Varactor Oscillator Input

X2

817

158

Buffer Output

OUT

665

1015

Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or

left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are

recommended to be performed in ESD protected area.

Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The

coordinates may vary depending on sawing width and location, however, distances between pads are accurate.

ABSOLUTE MAXIMUM RATINGS

Parameter

Supply Voltage

Input Voltage

Power Dissipation

Storage Temperature

Note: Not valid for programming pin PV.

Symbol

VDD - VSS

VIN

PMAX

TST

Min

-0.3

VSS -0.3

-40

Max

6.0

VDD + 0.3

20

120

Unit

V

V

mW

oC

Note

1)

RECOMMENDED OPERATION CONDITIONS

Parameter

Supply Voltage

Supply Current

Operating Temperature

Crystal Load Capacitance

Symbol

VDD

ICC

TC

CL

Conditions

Vcc = 2.8 Volt

Min Typ Max Unit

2.7 2.8 5.5

V

0.85

mA

-30

+85

oC

7.0

pF

2 (5)

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