MAX3760 データシートの表示（PDF） - Maxim Integrated
部品番号
コンポーネント説明
メーカー
MAX3760
Maxim Integrated
MAX3760 Datasheet PDF : 9 Pages
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622Mbps, Low-Noise Transimpedance
Preamplifier for LAN and WAN Optical Receivers
Wire Bonding
For high current density and reliable operation, the
MAX3760 uses gold metalization. Make connections to
the die with gold wire only, using ball-bonding tech-
niques. Wedge bonding is not recommended. Die-pad
size is 4 mils square, with 6 mil pitch. Die thickness is
15 mils.
___________________Chip Topography
INREF FILTER IN
GND
VCC
GND
COMP 0.042"
(1.05mm)
OUT-
OUT+
0.030"
(0.75mm)
TRANSISTOR COUNT: 131
SUBSTRATE CONNECTED TO GND
8 _______________________________________________________________________________________
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