MC34151, MC33151
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Voltage
Logic Inputs (Note 1)
Drive Outputs (Note 2)
Totem Pole Sink or Source Current
Diode Clamp Current (Drive Output to VCC)
Power Dissipation and Thermal Characteristics
D Suffix SOIC−8 Package Case 751
Maximum Power Dissipation @ TA = 50°C
Thermal Resistance, Junction−to−Air
P Suffix 8−Pin Package Case 626
Maximum Power Dissipation @ TA = 50°C
Thermal Resistance, Junction−to−Air
Operating Junction Temperature
Operating Ambient Temperature
MC34151
MC33151
MC33151V
Storage Temperature Range
Electrostatic Discharge Sensitivity (ESD) (Note 3)
Human Body Model (HBM)
Machine Model (MM)
Charged Device Model (CDM)
VCC
Vin
IO
IO(clamp)
20
−0.3 to VCC
1.5
1.0
PD
RqJA
PD
RqJA
TJ
TA
Tstg
ESD
0.56
180
1.0
100
+150
0 to +70
−40 to +85
−40 to +125
−65 to +150
2000
200
1500
V
V
A
W
°C/W
W
°C/W
°C
°C
°C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. For optimum switching speed, the maximum input voltage should be limited to 10 V or VCC, whichever is less.
2. Maximum package power dissipation limits must be observed.
3. ESD protection per JEDEC Standard JESD22−A114−F for HBM
per JEDEC Standard JESD22−A115−A for MM
per JEDEC Standard JESD22−C101D for CDM.
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