MSM65514 データシートの表示（PDF） - Oki Electric Industry

部品番号

コンポーネント説明

メーカー

MSM65514

High Performance 8-Bit Microcontroller

Oki Electric Industry 

¡ Semiconductor

PACKAGE DIMENSIONS

SDIP64-P-750-1.78

MSM65514/65P514

(Unit : mm)

Notes for Mounting the Surface Mount Type Package

Package material

Lead frame material

Pin treatment

Solder plate thickness

Package weight (g)

Epoxy resin

Cu alloy

Solder plating

5 mm or more

8.70 TYP.

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which

are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

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