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M80C85 データシートの表示(PDF) - Oki Electric Industry

部品番号
コンポーネント説明
メーカー
M80C85
OKI
Oki Electric Industry OKI
M80C85 Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
¡ Semiconductor
QFJ28-P-S450-1.27
MSM82C53-2RS/GS/JS
(Unit : mm)
Spherical surface
Notes for Mounting the Surface Mount Type Package
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
Cu alloy
Solder plating
5 mm or more
1.00 TYP.
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
18/19

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