PCF2113 データシートの表示（PDF） - NXP Semiconductors.

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コンポーネント説明

メーカー

PCF2113

LCD controllers/drivers

NXP Semiconductors. 

NXP Semiconductors

PCF2113x

LCD controllers/drivers

Table 30. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350

350 to 2000

< 1.6

260

260

1.6 to 2.5

260

250

> 2.5

250

245

> 2000

260

245

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 42.

temperature

maximum peak temperature

= MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 42. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

PCF2113_FAM_4

Product data sheet

Rev. 04 — 4 March 2008

© NXP B.V. 2008. All rights reserved.

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