PC85133-1 データシートの表示（PDF） - NXP Semiconductors.
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PC85133-1 Datasheet PDF : 53 Pages
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NXP Semiconductors
PCF85133
Universal LCD driver for low multiplex rates
Table 23. Bump locations …continued
All x/y coordinates represent the position of the center of each bump with respect to the center
(x/y = 0) of the chip; see Figure 25.
Symbol Bump X (m) Y (m)
Description
D1
-
1932.03 436.5 [2] dummy pad
D2
-
1909.53 436.5
D3
-
1801.53 436.5
D4
-
1693.53 436.5
D5
-
1585.53 436.5
D6
-
1477.53 436.5
D7
-
1846.35 436.5
dummy pad
D8
-
1953 436.5
D9
-
1930.05 436.5
[1] For most applications SDA and SDAACK are shorted together; see Section 8.
[2] The dummy pads are connected to VSS but are not tested.
Table 24. Gold bump hardness
Type number
Min
PCF85133U/2DA/1
60
[1] Pressure of diamond head: 10 g to 50 g.
Max
120
Unit[1]
HV
5()
6
5() &
DDK
The approximate positions of the alignment marks are shown in Figure 25.
Fig 26. Alignment marks of PCF85133
Table 25.
Symbol
S1
C1
Alignment mark locations
Size (m)
81 81
81 81
X (m)
1916.1
1855.8
Y (m)
45
45
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
PCF85133
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 4 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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