HI1166(1998) データシートの表示（PDF） - Intersil
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HI1166 Datasheet PDF : 12 Pages
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HI1166
Ceramic Leadless Chip Carrier Packages (CLCC)
j x 45o
0.010 S E H S
D
D3
B
E3 E
h x 45o
A
-E-
L
0.010 S E F S
A1
PLANE 2
PLANE 1
0.007 M E F S H S
B1
e
L3
-H-
-F-
B3
E1
E2
L2
B2
L1
e1
D2
D1
J68.A
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.067
0.087
1.70
2.20
6, 7
A1
0.058
0.072
1.47
1.83
-
B
-
-
-
-
-
B1
0.033
0.039
0.85
0.99
2, 4
B3
0.006
0.022
0.15
0.56
-
D
0.940
0.965 23.88
24.51
-
D1
0.800 BSC
20.32 BSC
-
D2
0.400 BSC
10.16 BSC
-
D3
0.616
0.632 15.65
16.05
2
E
0.940
0.965 23.88
24.51
-
E1
0.800 BSC
20.32 BSC
-
E2
0.400 BSC
10.16 BSC
-
E3
0.616
0.632 15.65
16.05
2
e
0.050 BSC
1.27 BSC
-
e1
0.015
-
0.38
-
2
j
0.040 Ref
1.00 Ref
5
L
0.045
0.055
1.14
1.40
-
L1
0.045
0.055
1.14
1.40
-
L2
0.075
0.095
1.91
2.41
-
L3
0.003
0.015
0.08
0.38
-
ND
17
17
3
NE
17
17
3
N
68
68
3
Rev. 0 5/18/94
NOTES:
1. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
2. Unless otherwise specified, a minimum clearance of 0.015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
4. The required plane 1 terminals and optional plane 2 terminals (if
used) shall be electrically connected.
5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Dimension “A” controls the overall package thickness. The maxi-
mum “A” dimension is package height before being solder dipped.
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
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out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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