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HI7188(2000) データシートの表示(PDF) - Intersil

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HI7188 Datasheet PDF : 24 Pages
First Prev 21 22 23 24
Die Characteristics
DIE DIMENSIONS:
215 mils x 257 mils
(5466µm x 6536µm)
METALLIZATION:
Type: AlSiCu
Thickness:Metal 2 16kÅ
Metal 1 6kÅ
SUBSTRATE POTENTIAL:
AVSS
Metallization Mask Layout
HI7188
PASSIVATION:
Type: Sandwich
Nitride Thickness: 8kÅ
USG Thickness: 1kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105 A/cm2
PROCESS:
HBCIO
HI7188
23

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