PS8601, PS8601L
SOLDERING PRECAUTION
(1) Infrared reflow soldering
• Peak temperature : 235 C or lower (plastic surface)
• Time
: 30 s or less
(Time during plastic surface temperature overs 210 C)
• No. of reflow times : Three
• Flux
: Rosin-base flux
INFRARED RAY REFLOW TEMPERATURE PROFILE
120 to 160 ˚C
60 to 90 s
(PRE-HEAT)
(ACTUAL HEAT)
to 10 s
235 ˚C MAX
210 ˚C
to 30 s
TIME (s)
<NOTES>
(1) Please avoid be removed the residual flux by water after the first reflow processes.
Peak Temperature 235 ˚C or lower
(2) Dip soldering
• Peak temperature : 260 C or lower
• Time
: 10 s or less
• Flux
: Rosin-base flux
8