PZ3064 データシートの表示（PDF） - Philips Electronics

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PZ3064

64 macrocell CPLD

Philips Electronics 

Philips Semiconductors

64 macrocell CPLD

Product specification

PZ3064

Package Thermal Characteristics

Philips Semiconductors uses the Temperature Sensitive Parameter

(TSP) method to test thermal resistance. This method meets

Mil-Std-883C Method 1012.1 and is described in Philips 1995 IC

Package Databook. Thermal resistance varies slightly as a function

of input power. As input power increases, thermal resistance

changes approximately 5% for a 100% change in power.

Figure 7 is a derating curve for the change in ΘJA with airflow based

on wind tunnel measurements. It should be noted that the wind flow

dynamics are more complex and turbulent in actual applications

than in a wind tunnel. Also, the test boards used in the wind tunnel

contribute significantly to forced convection heat transfer, and may

not be similar to the actual circuit board, especially in size.

Package

44-pin PLCC

44-pin TQFP

68-pin PLCC

84-pin PLCC

100-pin PQFP

ΘJA

44.8°C/W

60.8°C/W

44.9°C/W

34.7°C/W

44.5°C/W

PERCENTAGE 0

REDUCTION IN

ΘJA (%)

10

20

30

40

50

0

PLCC/

QFP

1

2

3

4

5

AIR FLOW (m/s)

SP00419A

Figure 7. Average Effect of Airflow on ΘJA

1997 Mar 05

93

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