4.8 Mechanical - 32-QFN Package
B
F
PIN 1
e
C
G
Min
Nom.
A
A1
0.00
0.01
A2
0.65
A3
0.20 Ref.
B
5.00
C
5.00
D
0.20
0.25
E
0.30
0.40
F
3.35
3.50
G
3.35
3.50
e
0.50 bsc
All dimensions in millimetres
Max
0.90
0.05
0.70
0.32
0.50
3.65
3.65
D
A A2
A1
E
A3
Note that there is no functional requirement for the large pad on the underside of this package to be
soldered. If the final application requires this area to be soldered for mechanical reasons, the pad to
which it is soldered to must be isolated and contained under the footprint only.
4.9 Mechanical - 48-SSOP Package
A
B
C
G
D
E
F
J
H
a
All dimensions in millimeters
A
B
C
D
E
F
G
H
J
a
Min 10.03 7.39
0.20
2.16
0.64
0.10 15.57 0.10
0.64
0o
Max 10.67 7.59
0.30
2.51
Typ
0.25 16.18 0.30
0.89
8o
lQ
12
QT1080 R11.03/0905