RF3145 データシートの表示（PDF） - RF Micro Devices

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RF3145

QUAD-BAND GSM/EDGE/GSM850/DCS/PCS POWER AMPLIFIER MODULE

RF Micro Devices 

RF3145

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch

to 8μinch gold over 180μinch nickel.

PCB Land Pattern Recommendation

PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested

for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-

cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.

PCB Metal Land and Solder Mask Pattern

A = 0.80 Sq. Typ.

B = 0.95 x 0.87 Typ.

C = 0.87 x 0.95

Dimensions in mm.

A = 0.80 (mm) Sq. Typ.

Pin 1

8.40 Typ.

A

A

7.00

A

5.60

A

4.20

A

2.80

A

1.40

A

0.00

A

A

7.60

0.80

Pin 1

8.36

ABAAAAA

7.40

AA

AAA

5.35

3.15

1.00

0.04

0.00

AA

AAA

AA

A AC

AA

AAA

AA

AAA

ABAAAAA

8.40 Typ.

7.00 Typ.

5.60 Typ.

4.20 Typ.

2.80 Typ.

1.40 Typ.

Metal Land Pattern

Solder Mask Pattern

18 of 18

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

Rev A4 DS050919

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