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FDD3580 データシートの表示(PDF) - Fairchild Semiconductor

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FDD3580
Fairchild
Fairchild Semiconductor Fairchild
FDD3580 Datasheet PDF : 5 Pages
1 2 3 4 5
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Drain-Source Avalanche Ratings (Note 2)
WDSS
Single Pulse Drain-Source
Avalanche Energy
VDD = 40 V, ID = 7.7 A
245
mJ
IAR
Maximum Drain-Source
Avalanche Current
7.7
A
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA
80
V
BVDSS
TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
ID = 250 µA, Referenced to 25°C
VDS = 64 V, VGS = 0 V
79
mV/°C
1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = 20 V, VDS = 0 V
100
nA
IGSSR
Gate–Body Leakage, Reverse
VGS = –20 V, VDS = 0 V
–100 nA
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = 250 µA
ID = 250 µA, Referenced to 25°C
2
2.5
4
V
7
mV/°C
VGS = 10 V, ID = 7.7 A
23 29
m
VGS = 6 V, ID = 7.2 A
24 33
VGS = 10 V, ID = 7.7 A,TJ=125°C
37 50
VGS = 10 V, VDS = 10 V
30
A
VDS = 10 V, ID = 7.7 A
28
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 40 V, V GS = 0 V,
f = 1.0 MHz
1760
pF
144
pF
72
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
VDD = 40 V, ID = 1 A,
VGS = 10 V, RGEN = 6
VDS = 40V, ID = 7.7 A,
VGS = 10 V,
13 23
ns
8
16
ns
34 54
ns
16 29
ns
35 49
nC
6.2
nC
8.6
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
VGS = 0 V, IS = 3.2 A (Note 2)
Voltage
3.2
A
0.73 1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) RθJA = 40 °C/W when mounted on a
1in2 pad of 2 oz copper.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
b) RθJA = 96 °C/W when mounted
on a minimum pad.
FDD3580/FDU3580 Rev. A1(W)

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