RT8269GSP データシートの表示（PDF） - Richtek Technology
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RT8269GSP Datasheet PDF : 12 Pages
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RT8269
Electrical Characteristics
(VIN = 12V, TA = 25°C unless otherwise specified)
Parameter
Symbol
Feedback Reference Voltage
High Side Switch-On Resistance
Low Side Switch-On Resistance
Switch Leakage
VFB
RDS (ON )1
RDS (ON )2
Current Limit
ILIM
Current Sense Transconductance GCS
Error Amplifier Tansconductance Gm
Oscillator Frequency
fSW
Short Circuit Oscillation Frequency
Maximum Duty Cycle
Minimum On-Time
Under Voltage Lockout Threshold
DM AX
tON
Ris ing
Under Voltage Lockout Threshold
H ysteresis
En input Low Voltage
En input High Voltage
Enable Pull Up Current
Shutdown Current
Quiescent Current
Soft-Start Current
Soft-Start Period
ISHDN
IQ
ISS
Thermal Shutdown
TSD
Test Conditions
Min
4.75V ≤ VIN ≤ 24V
0.902
--
--
VEN = 0V, VSW = 0V
--
Duty = 90%; VBOOT−SW = 4.8V 3.6
Output Current to VCOMP
--
ΔIC = ±10μA
500
350
VFB = 0V
--
VFB = 0.8V
--
--
3.8
--
--
1.4
0.15
VEN = 0V
--
VEN = 2V, VFB = 1V
--
--
CSS = 0.1μF
--
--
Typ
0.92
0.1
10
--
4.4
4
680
400
120
90
100
Max
0.938
0.16
--
10
5.2
--
900
450
--
--
--
Unit
V
Ω
Ω
μA
A
A/V
μA/V
k Hz
k Hz
%
ns
4.2 4.5 V
300 -- mV
-- 0.4 V
--
--
V
1 2.65 μA
25
--
μA
0.8 1 mA
10
--
μA
10
--
ms
150 --
°C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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4
To be continued
DS8269-02 March 2011
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