S34ML01G100TFI010 データシートの表示（PDF） - Spansion Inc.
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S34ML01G100TFI010 Datasheet PDF : 73 Pages
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Spansion® SLC NAND Flash Memory for
Embedded
1 Gb, 2 Gb, 4 Gb Densities:
1-bit ECC, x8 and x16 I/O, 3V VCC
S34ML01G1, S34ML02G1, S34ML04G1
Data Sheet (Preliminary)
Distinctive Characteristics
Density
– 1 Gbit / 2 Gbit / 4 Gbit
Architecture
– Input / Output Bus Width: 8-bits / 16-bits
– Page Size:
– x8 = 2112 (2048 + 64) bytes; 64 bytes is spare area
– x16 = 1056 (1024 + 32) words; 32 words is spare area
– Block Size: 64 Pages
– x8 = 128k + 4k bytes
– x16 = 64k + 2k words
– Plane Size:
– 1 Gbit / 2 Gbit: 1024 Blocks per Plane
x8 = 128M + 4M bytes
x16 = 64M + 2M words
– 4 Gbit: 2048 Blocks per Plane
x8 = 256M + 8M bytes
x16 = 128M + 4M words
– Device Size:
– 1 Gbit: 1 Plane per Device or 128 Mbyte
– 2 Gbit: 2 Planes per Device or 256 Mbyte
– 4 Gbit: 2 Planes per Device or 512 Mbyte
NAND Flash Interface
– Open NAND Flash Interface (ONFI) 1.0 compliant
– Address, Data and Commands multiplexed
Supply Voltage
– 3.3V device: Vcc = 2.7V ~ 3.6V
Security
– One Time Programmable (OTP) area
– Serial number (unique ID)
– Hardware program/erase disabled during power transition
Additional Features
– 2 Gb and 4 Gb parts support Multiplane Program and Erase
commands
– Supports Copy Back Program
– 2 Gb and 4 Gb parts support Multiplane Copy Back Program
– Supports Read Cache
Electronic Signature
– Manufacturer ID: 01h
Operating Temperature
– Commercial: 0°C to 70°C
– Extended: -25°C to 85°C
– Industrial: -40°C to 85°C
Performance
Page Read / Program
– Random access: 25 µs (Max)
– Sequential access: 25 ns (Min)
– Program time / Multiplane Program time: 200 µs (Typ)
Block Erase (S34ML01G1)
– Block Erase time: 2.0 ms (Typ)
Block Erase / Multiplane Erase (S34ML02G1, S34ML04G1)
– Block Erase time: 3.5 ms (Typ)
Reliability
– 100,000 Program / Erase cycles (Typ)
(with 1 bit ECC per 528 bytes (x8) or 264 words (x16))
– 10 Year Data retention (Typ)
– Block zero is a valid block and will be valid for at least 1000
program-erase cycles
Package Options
– Lead Free and Low Halogen
– 48-Pin TSOP 12 x 20 x 1.2 mm
– 63-Ball BGA 9 x 11 x 1 mm
Publication Number S34ML01G1_04G1
Revision 10
Issue Date September 6, 2012
This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qual-
ification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document
may be revised by subsequent versions or modifications due to changes in technical specifications.
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