SA5211 データシートの表示（PDF） - Philips Electronics

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SA5211

Transimpedance amplifier (180 MHz)

Philips Electronics 

Philips Semiconductors

SA5211

Transimpedance amplifier (180 MHz)

processes are utilized for wafer sawing and die pick and place into waffle pack

carriers, it is impossible to guarantee 100% functionality through this process. There

is no post waffle pack testing performed on individual die.

Since Philips Semiconductors has no control of third party procedures in the handling

or packaging of die, Philips Semiconductors assumes no liability for device

functionality or performance of the die or systems on any die sales.

Although Philips Semiconductors typically realizes a yield of 85% after assembling

die into their respective packages, with care customers should achieve a similar yield.

However, for the reasons stated above, Philips Semiconductors cannot guarantee

this or any other yield on any die sales.

9397 750 07427

Product specification

Rev. 03 — 07 October 1998

© Philips Electronics N.V. 2001. All rights reserved.

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