XC236X データシートの表示（PDF） - Infineon Technologies

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XC236X

16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

Infineon Technologies 

XC2365

XC2000 Family Derivatives

Preliminary

Package and Reliability

5.2

Thermal Considerations

When operating the XC236x in a system, the total heat generated on the chip must be

dissipated to the ambient environment to prevent overheating and resulting thermal

damages.

The maximum heat that can be dissipated depends on the package and its integration

into the target board. The “Thermal resistance RΘJA” is a measure for these parameters.

The power dissipation must be limited so the average junction temperature does not

exceed 150 °C.

The difference between junction temperature and ambient temperature is determined by

∆T = (PINT + PIOSTAT + PIODYN) × RΘJA

The internal power consumption is defined as

PINT = VDDP × IDDP (see Table 14).

The static external power consumption caused by the output drivers is defined as

PIOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)

The dynamic external power consumption caused by the output drivers (PIODYN) depends

on the capacitive load connected to the respective pins and the switching frequencies.

If the total power dissipation determined for a given system configuration exceeds the

defined limit countermeasures must be taken to ensure proper system operation:

• Reduce VDDP, if possible in the system

• Reduce the system frequency

• Reduce the number of output pins

• Reduce the load on active output drivers

Data Sheet

96

V0.1, 2007-06

Draft Version

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