SACB5.0 データシートの表示（PDF） - Littelfuse, Inc

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SACB5.0

Transient Voltage Suppression Diodes

Littelfuse, Inc 

Transient Voltage Suppression Diodes

Surface Mount – 500W > SACB series

Soldering Parameters

Reflow Condition

- Temperature Min (Ts(min))

Pre Heat - Temperature Max (Ts(max))

- Time (min to max) (ts)

Average ramp up rate (Liquidus Temp (TA)

to peak

TS(max) to TA - Ramp-up Rate

Reflow

- Temperature (TA) (Liquidus)

- Time (min to max) (ts)

Peak Temperature (TP)

Time within 5°C of actual peak

Temperature (tp)

Ramp-down Rate

Time 25°C to peak Temperature (TP)

Do not exceed

Lead–free

assembly

150°C

200°C

60 – 180 secs

3°C/second max

3°C/second max

217°C

60 – 150 seconds

260+0/-5 °C

20 – 40 seconds

6°C/second max

8 minutes Max.

260°C

Physical Specifications

Weight

Case

Polarity

Terminal

0.003oz., 0.093g

JEDEC DO-214AA molded plastic body

over glass passivated junction.

Color band denotes cathode except

Bidirectional

Matte Tin-plated leads. Solderable per

JESD22-B102.

TP

TL

Ts(max)

Ts(min)

25˚C

Ramp-up

tp

tL

Critical Zone

TL to TP

ts

Preheat

Ramp-down

t 25˚C to Peak

Time (t)

Flow/Wave Soldering (Solder Dipping)

Peak Temperature :

Dipping Time :

Soldering :

265OC

10 seconds

1 time

Environmental Specifications

High Temp. Storage

JESD22-A103

HTRB

JESD22-A108

Temperature Cycling

JESD22-A104

MSL

JEDEC-J-STD-020, Level 1

H3TRB

JESD22-A101

RSH

JESD22-A111

Dimensions

DO-214AA (SMB J-Bend)

Cathode Band

A

C

B

H

D

F

E

G

Dimension in inches and (millimeters)

© 2016 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 09/27/16

Dimensions

A

B

C

D

E

F

G

H

Inches

Min

Max

0.077

0.086

0.160

0.180

0.130

0.155

0.084

0.096

0.030

0.060

-

0.008

0.205

0.220

0.006

0.012

Millimeters

Min

Max

1.950

2.200

4.060

4.570

3.300

3.940

2.130

2.440

0.760

1.520

-

0.203

5.210

5.590

0.152

0.305

33

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