8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
I
J
J
J
K
NM
IL
N
K
O
O
PCB Footprint Top View
Case and PCB Footprint Dimensions
Dimension
mm
Min Nom Max Min
A
2.87 3.0 3.13 0.113
B
2.87 3.0 3.13 0.113
C
1.14 1.27 1.40 0.045
D
0.79 0.92 1.05 0.031
E
0.62 0.75 0.88 0.024
F
0.47 0.60 0.73 0.018
G
0.47 0.60 0.73 0.018
H
1.07 1.20 1.33 0.042
I
3.19
J
0.81
K
0.96
L
0.81
M
1.39
N
0.23
O
0.38
Inches
Nom
0.118
0.118
0.050
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
Max
0.123
0.123
0.055
0.041
0.034
0.029
0.029
0.052
Case Materials
Solder Pad
Plating
Lid Plating
Body
Materials
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al2O3 Ceramic
Pb Free
1
A2
3
TOP VIEW
BOTTOM VIEW
B
C
E
8
8
7
7
1
H
6
5
4
6
2
G
5
3
4
D
F
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©2009-2010 by RF Monolithics, Inc.
Page 5 of 6
SF2159E - 7/19/10