CS or
HBE
R/C
tS
tH
tW
BUSY
Data
BUS
Data Valid
Figure 7. Conversion Start Timing
tDBC
Hi-Z State
tHDR and tHL
ORDERING INFORMATION
0°C to +70°C
Model
Throughput
Package
SP8503KN .................................................................... 333kHz ................................................................................................ 28–pin 0.3" Plastic DIP
SP8503KS .................................................................... 333kHz ........................................................................................................ 28–pin, 0.3" SOIC
SP8505KN .................................................................... 200kHz ................................................................................................ 28–pin 0.3" Plastic DIP
SP8505KS .................................................................... 200kHz ........................................................................................................ 28–pin, 0.3" SOIC
SP8510KN .................................................................... 100kHz ................................................................................................ 28–pin 0.3" Plastic DIP
SP8510KS .................................................................... 100kHz ........................................................................................................ 28–pin, 0.3" SOIC
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