STV7733WPB3 データシートの表示（PDF） - STMicroelectronics
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STV7733WPB3 Datasheet PDF : 28 Pages
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STV7733
Pad dimensions (in microns)/pad positions
Table 9. Pad placement and bump dimensions (in microns) (continued)
Lead pad name
Pad placements
X
Y
Bump dimensions(1)
X
Y
OUT170
-645.9
600.6
51.0
73.1
OUT169
-577.9
600.6
51.0
73.1
OUT168
-509.9
600.6
51.0
73.1
OUT167
-441.9
600.6
51.0
73.1
OUT166
-373.9
600.6
51.0
73.1
OUT165
-305.9
600.6
51.0
73.1
OUT164
-237.9
600.6
51.0
73.1
OUT163
-169.9
600.6
51.0
73.1
OUT162
-101.9
600.6
51.0
73.1
OUT161
-33.9
600.6
51.0
73.1
OUT160
34.1
600.6
51.0
73.1
OUT159
102.1
600.6
51.0
73.1
OUT158
170.1
600.6
51.0
73.1
OUT157
238.1
600.6
51.0
73.1
OUT156
306.1
600.6
51.0
73.1
OUT155
374.1
600.6
51.0
73.1
OUT154
442.1
600.6
51.0
73.1
OUT153
510.1
600.6
51.0
73.1
OUT152
578.1
600.6
51.0
73.1
OUT151
646.1
600.6
51.0
73.1
OUT150
714.1
600.6
51.0
73.1
OUT149
782.1
600.6
51.0
73.1
OUT148
850.1
600.6
51.0
73.1
OUT147
918.1
600.6
51.0
73.1
OUT146
986.1
600.6
51.0
73.1
OUT145
1054.1
600.6
51.0
73.1
OUT144
1122.1
600.6
51.0
73.1
OUT143
1190.1
600.6
51.0
73.1
OUT142
1258.1
600.6
51.0
73.1
OUT141
1326.1
600.6
51.0
73.1
OUT140
1394.1
600.6
51.0
73.1
OUT139
1462.1
600.6
51.0
73.1
OUT138
1530.1
600.6
51.0
73.1
19/28
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