STV7733/BMP データシートの表示（PDF） - STMicroelectronics
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STV7733/BMP Datasheet PDF : 28 Pages
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Pad dimensions (in microns)/pad positions
STV7733
Table 9. Pad placement and bump dimensions (in microns) (continued)
Lead pad name
Pad placements
X
Y
Bump dimensions(1)
X
Y
OUT137
1598.1
600.6
51.0
73.1
OUT136
1666.1
600.6
51.0
73.1
OUT135
1734.1
600.6
51.0
73.1
OUT134
1802.1
600.6
51.0
73.1
OUT133
1870.1
600.6
51.0
73.1
OUT132
1938.1
600.6
51.0
73.1
OUT131
2006.1
600.6
51.0
73.1
OUT130
2074.1
600.6
51.0
73.1
OUT129
2142.1
600.6
51.0
73.1
OUT128
2210.1
600.6
51.0
73.1
OUT127
2278.1
600.6
51.0
73.1
OUT126
2346.1
600.6
51.0
73.1
OUT125
2414.1
600.6
51.0
73.1
OUT124
2482.1
600.6
51.0
73.1
OUT123
2550.1
600.6
51.0
73.1
OUT122
2618.1
600.6
51.0
73.1
OUT121
2686.1
600.6
51.0
73.1
OUT120
2754.1
600.6
51.0
73.1
OUT119
2822.1
600.6
51.0
73.1
OUT118
2890.1
600.6
51.0
73.1
OUT117
2958.1
600.6
51.0
73.1
OUT116
3026.1
600.6
51.0
73.1
OUT115
3094.1
600.6
51.0
73.1
OUT114
3162.1
600.6
51.0
73.1
OUT113
3230.1
600.6
51.0
73.1
OUT112
3298.1
600.6
51.0
73.1
OUT111
3366.1
600.6
51.0
73.1
OUT110
3434.1
600.6
51.0
73.1
OUT109
3502.1
600.6
51.0
73.1
OUT108
3570.1
600.6
51.0
73.1
OUT107
3638.1
600.6
51.0
73.1
OUT106
3706.1
600.6
51.0
73.1
OUT105
3774.1
600.6
51.0
73.1
20/28
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