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SY10E175JCTR データシートの表示(PDF) - Micrel

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SY10E175JCTR
Micrel
Micrel Micrel
SY10E175JCTR Datasheet PDF : 4 Pages
1 2 3 4
Micrel, Inc.
TRUTH TABLE
D
LEN MR
Q
ODDPAR
H
L
L
H
H if odd no. of Dn HIGH
L
L
L
L
H if odd no. of Dn HIGH
X
H
L
Q0
Q0
X
X
H
L
L
SY10E175
SY100E175
DC ELECTRICAL CHARACTERISTICS
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
TA = 0°C
TA = +25°C
TA = +85°C
Symbol
Parameter
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
IIH
Input HIGH Current
— — 150 — — 150 — — 150 µA
IEE
Power Supply Current
mA
10E 110 132 110 132 110 132
100E 110 132 110 132 127 152
Condition
AC ELECTRICAL CHARACTERISTICS
VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND
TA = 0°C
TA = +25°C
TA = +85°C
Symbol
Parameter
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
tPD
Propagation Delay to Output
ps
D to Q
450 600 800 450 600 800 450 600 800
D to ODDPAR
850 1150 1450 850 1150 1450 850 1150 1450
LEN to Q
525 700 900 525 700 900 525 700 900
LEN to ODDPAR
525 700 900 525 700 900 525 700 900
MR to Q (tPHL)
525 700 900 525 700 900 525 700 900
MR to ODDPAR (tPHL)
525 700 900 525 700 900 525 700 900
tS
Set-up Time
D (Q)
D (ODDPAR)
ps
275 100 275 — — 275 — —
900 700 900 — — 900 — —
tH
Hold Time
D (Q)
D (ODDPAR)
ps
175 100 175 — — 175 — —
300 700 — –300 — — –300 — —
tRR
Reset Recovery Time
850 600 850 600 850 600 ps
tskew
Within-Device Skew
LEN, MR
D to Q
D to ODDPAR
ps
75 — — 75 — — 75
75 — — 75 — — 75
200 — — 200 — — 200
tr
Rise/Fall Times
tf
2080%
300 500 800 300 500 800 300 500 800 ps
Note:
1. Within-device skew is defined as identical transitions on similar paths
through a device.
Condition
1
M9999-032006
hbwhelp@micrel.com or (408) 955-1690
3

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